Я лично там все одно ничего не понимаю любые соображения очень даже велком. Если чо, то чела направлю на форум пусть сам тут бьется на английском, по-русски он не ферштейн... увы.
В общем буду премного благодарен за любые соображения.
ФИО, Ph.D.
Objective
A full time position in new product development in the LED lighting industry or in the fields of Thermal Management and MEMS Research and Development where wide knowledge of product development and balancing of associated costs and benefits plays a major roll.
Work Experience
BritePointe, Hayward, CA 2009 –Present
(Formerly Progressive Cooling Solutions Inc, Berkeley, CA)
Senior Scientist
· Successfully developed a luminaire product from alpha prototype stage to production through qualification testing, environmental failure analysis and UL compliance.
· Co-inventor of LED “light bulb” to replace 400W, 600W and 1000W high-bay lights at industrial locations. Accomplished energy savings by about 50% while more than doubling the lifespan of a typical light.
· Designed and constructed a computer-controlled end-of-the-line tester to test the lumen output and correct functionality of the thermal and electrical systems of the luminaire for high volume manufacturing line.
· Responsible for assembly of high brightness LED arrays some dissipating over 430W of heat, testing and thermo-mechanical coupling of such arrays to thermal platforms for cooling.
· Developed brazing and welding based packaging schemes and other unique assembly processes and realized vacuum-encapsulated evaporator assembly for a mini-loop heat pipe.
· Developed non-conventional loop heat pipe (LHP) based thermal platforms for high heat flux applications in consumer products overcoming high cost hurdles of such devices.
· Formulated thermo-hydraulic designs, support hardware and various micro assemblies to fabricate LHPs and created computer platforms to test and analyze such LHPs.
Siemens TTB, Berkeley, CA 2007 – 2009
Innovator
· Integral member of a multi-disciplinary engineering research and development team working on a miniature heat transport system (mLHP).
· Developed initial designs, packaging schemes and assembly processes for a vacuum-encapsulated MEMS-based loop heat pipe and achieved an un-optimized yet functional prototype.
· Explored possibilities of application of mLHP to products of different Siemens groups, such as the Siemens Industrial Automation and Drive Technologies and Fujitsu Siemens, and actively participated in preparation of patent documents, written summaries and formal reports.
· Research enabled spin-off of Progressive Cooling Solutions Inc.
Institute of Materials Research and Engineering, Singapore 2006 – 2007
Research Engineer
· Developed mini liquid/solid lens-modules for consumer products such as camera-phones.
· Supervised the group involved with the prototype design through testing.
· Research enabled spin-off of a Singaporean company.
University of Cincinnati, Cincinnati, OH 1999 – 2005
Graduate Research Assistant
· Designed, fabricated and tested a silicon planar loop heat pipe (a NASA funded project) based upon micron-sized straight capillary holes through silicon wafers to form a “porous wick”, which serves as the “pump”.
· Worked as a team member of a DARPA funded project to develop “A Hybrid Mini/Micro Fluidic System towards a Lab-on-a-Chip for Bio-chemical Immuno Assay”.
· Completed other design projects such as: a miniature vacuum disconnect, a scheme to attach miniature metallic tubes to planar semiconductor silicon and glass substrates, polymer collapsible reservoir, integrated thin film heaters and RTDs, a micromachining technique based on ultrasonic impact grinding and a custom data acquisition system to control the experiments and log the data by accessing sensors.
Skills
· Prototype and product development in a cost effective manner including handling of vendors.
· Training the staff of manufacturing partners and transferring the technical know-how during the transition from beta prototype to high volume production.
· Proficient in AutoCAD, LabVIEW, Mathematica, Photoshop and Illustrator and hardware integration and control.
· Wide knowledge in troubleshooting faults in equipments, retrofitting and fixing, and handling of high vacuum systems.
· Proficient in clean room processes relating to semiconductor processing and MEMS fabrication such as lithography, oxidation, diffusion, etching, sputtering, evaporation, lapping, dicing, bonding, and use and maintenance of such equipment.
· Excellent working knowledge in soldering/vacuum reflow, brazing and welding, and machining metal, glass and polymer.
· Thorough knowledge in designing, fabrication and testing of small electronic circuits.
Patents, Patent Applications and Publications
· US Patent 7,705,342 B2 “Porous semiconductor-based evaporator having porous and non-porous regions, the porous regions having through holes”, April 27, 2010.
· US Patent 7,692,926 B2 “Integrated thermal systems”, April 6, 2010.
· US Patent 7,723,845 B2 “System and method of a heat transfer system with an evaporator and condenser”, May 25, 2010.
· US Patent 7,723,760 B2 “Semiconductor-based porous structure enabled by capillary force”, May 25, 2010.
· US Application 12/860,707 “LED Bulb for High Intensity Discharge Bulb Replacement”, August 20, 2009.
· US Application 61/643,045, “Heat Transfer Device”, May 4, 2012
· Fourteen peer-reviewed journal papers, conference papers and publications